With emphasis on interface delamination in thin film structures, a variety of phenomena are discussed. The effects of curvature of the substrate on buckling- driven delamination of thin films in compression are analysed. Details in the morphology of buckling-driven delamination and in particular the causes of the so-called telephone cord blister are discussed. Conditions for delamination at edges and corners are formulated and it is shown that steady-state delamination at a corner is possible at significantly lower stress levels than delaminations at straight-sided edges.